Modelling the complex solder-joint geometry for a bent axial pin
To build finite element models of through hole devices (THDs) in the project Modelling the reliability of through-hole-technology ...
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Auomatic modelling of THT soder-joints
To build finite element models of through hole devices (THDs) in the project Modelling the reliability of through-hole-technology ...
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Including industry standards in the parametric modelling of THDs
In our parametric hex-dominant finite element models of through hole devices (THDs), which we develop in the project 'Modelling ...
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Parametric hex-dominant finite element models of through hole devices
In the project 'Modelling the reliability of through-hole-technology assemblies' funded by ESA we develop a simulation process ...
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Structural Analysis of resin transfer molding of an entire PCBA
Encapsulation of electronics protects entire PCBAs against chamical cleaing as well as steam pressure sterilization in medical ...
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New R&D project funded by ESA
We're thrilled to share that we've recently started working on an exciting new project, proudly funded by the European Space ...
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Resin transfer molding of an entire PCBA
The FFG funded project vPrimePCBA aims for the development, implementation and validation of a concept for virtual prototyping ...
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Reaction injection molding of a PCBA
The FFG funded project vPrimePCBA aims for the development, implementation and validation of a concept for virtual prototyping ...
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Mechanical shock of an electrolytic capacitor (in-plane)
The mechanical shock in the out-of-plane direction of a PCB typically causes the largest deflections of the PCB and the largest ...
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