Modal sub-modelling

• 08 / 07 / 2024 

Performing a dynamic analysis of a printed circuit board assembly (PCBA) including the geometric details of the PCB and the solder joints can be a challenging task, because of the computational effort. Thus, we developed a modal based sub-modelling simulation process, in which a single modal analysis is performed for a PCBA consisting of a coarse PCB modeled with an orthotropic material field and solder-joint sub-structures calculated based on detailed solder-joint models. In the modal domain, then, global displacements are projected on cutting surfaces of submodels. This modal basis is then used to calculate frequency response functions for the submodel.

The video shows the animation of a frequency response function for a PCBA (the global model) mounted in an enclosure and for the submodel of an SOIC.