Anand model
- 16 / 11 / 2022
The Anand model is now available in our simulation process for the thermo-mechanical analysis of PCBAs. With the Anand model we can simulate the viscoplastic material behavior of solder. The video shows a simple test example with a J-Lead solder joint. Here the temperature is raised from room temperature to 105°C, then cooled to -40°C and raised again to room temperature. The contour plot shows the equivalent visco-plastic strain.
Video: Viscoplastic thermo-mechanical analysis of a J-lead solder Joint.
