Modelling THT-PCBAs
- 26 / 08 / 2025
In the project 'Modelling the reliability of through-hole-technology assemblies' funded by ESA we transfer our SMD modelling and simulation processes to the through-hole-Technology (THT). We can now build hex-dominant meshes of THT printed circuit board assemblies including through-hole devices (THDs) and solder joints for which the solder meniscus shape is calculated individually for each joint. The PCB is modelled by an temperature-dependent orthotropic material-field calculated with our machine learning based homogenization method.
The animation Shows an exemplary PCBA (a demo file from KiCad licensed under CC-BY-SA-4.0).Video: Exemplary finite element model of a THT-PCBA.
