Auomatic modelling of THT soder-joints

• 01 / 07 / 2025 

To build finite element models of through hole devices (THDs) in the project Modelling the reliability of through-hole-technology assemblies funded by ESA automatically, we adapt and extend our solder-joint modelling algorithms to the through hole technology. The animation shows steps of the solder-joint meniscus calculation process for a hand soldered pin of a ceramic dual inline package rendered in Paraview.