Modelling the complex solder-joint geometry for a bent axial pin

• 03 / 07 / 2025 

To build finite element models of through hole devices (THDs) in the project Modelling the reliability of through-hole-technology assemblies funded by ESA automatically, we adapt and extend our solder-joint modelling algorithms to the through hole Technology also for complex pin geometries. The animation shows steps of the solder-joint meniscus calculation process for an axial pin rendered in Paraview.