Thermal Analysis

  • 26 / 01 / 2023 

We improved our thermal analysis capabilities by modelling solder-joints as thermal sub-structures and by modelling PCBs by homogenized material fields. The thermal sub-structuring process is based on our structural sub-structuring algorithms and the thermal solder-joint sub-structures are automatically calculated from detailed solder-joint models. The homogenized material field is generated by a machine learning algorithm. The results of a thermal analysis can be used directly as load in a non-linear static analysis of PCBAs.

The animation shows a transient thermal analysis of a PCBA, in which seven SOICs on top of the PCBA are assumed to be heat sources that dissipate the power loss of the SMDs.