Garofalo model for visco-plastic behaviour of solder
- 31 / 05 / 2023
We implemented the Garofalo model as a viscoplastic material behaviour for solder joints. It can be used in thermo-mechanical analyses, e.g., thermal cycling, to model creep in solder joints.
The animation shows the thermal cycling of an SOIC with gullwing leads. The detailed PCBA cutout consisting of the SMD, the solder-joints, and a part of the PCB was embedded into a full PCBA model, which was modelled by homogenized material properties. The contour plot shows the equivalent visco-plastic strain in the solder.
Video: Viscoplastic thermo-mechanical analysis of an SOIC with gullwing leads subjected to thermal cycling.
