Thermo-mechanic sub-structures
- 16 / 02 / 2023
Our solder-joint sub-structures now can represent the thermal-expansion of a solder-joint. This means that we can now build efficient finite element models of PCBAs also for thermo-mechanic analyses, where each solder joint can be represented accurately by a single finite element.
The animation shows the static analysis of a simple thermo-mechanic test case (thermal shock) for a model including a detailed solder-joint model and for a model including a solder-joint sub-structure. For the second model, the detailed solder-joint results can be recovered from the sub-structure results. The color map represents the Von-Mises stress in the solder joint.
Video: Thermo-mechanic test case for thermal expansion of a solder-joint (sub-structure).
