Thermal cycling of BGA solder joint sub-models
- 22 / 07 / 2023
The structural zoom technique (also known as submodelling) can also be used to increase the accuracy of #FEA results in multiple regions of a finite element model in parallel by applying the displacements of a global model as boundary condition, e.g., for multiple solder balls of a #BGA chip.
The animation shows the structural zoom technique applied to two solder balls (corner solder balls in the first and second row) of a global BGA model. The Garofalo model was used to include the visco-plastic material behaviour in the model. The contour plot shows the equivalent visco-plastic strain in the solder.
Video: Visco-plastic thermo-mechanical analysis of two solder balls subjected to thermal cycling.
