New R&D project funded by ESA

• 13 / 03 / 2025 

We're thrilled to share that we've recently started working on an exciting new project, proudly funded by the European Space Agency (ESA). This opportunity marks a significant milestone for Elastic-Simulations GmbH, and we’are excited to contribute to innovations in the space sector.

The activity in two senctences:

The activity implements the automatic finite-element modelling of printed circuit board assemblies (PCBAs) based on the through-hole technology (THT) including detailed modelling of PCBs and THT solder joints, a simulation process for the thermo-mechanical analysis of PCBAs and solder joint reliability estimation based on low-cycle fatigue. All implementations in the activity are based on open-source software.

Stay tuned for updates as we work on new exciting automated methods and tools!