Resin transfer molding of an entire PCBA
- 11 / 03 / 2025
The FFG funded project vPrimePCBA aims for the development, implementation and validation of a concept for virtual prototyping of encapsulated electronics with protection against chemical cleaning as well as steam pressure sterilization for medical devices.
Together with Polymer Competence Center Leoben GmbH and Ottronic Regeltechnik Gesellschaft m.b.H. we develop a simulation process based on open-source software for the resin transfer molding (RTM) of PCBAs and investigate the impact of RIM on solder joints.
The animation shows the filling stage of a RTM process for a simplified generic PCBA assembled with chip resistors, MLCCs and QFNs. For the simulation, we used a coupled finite element formulation of the momentum, continuity, energy and a level-set equation considering curing kinetics and rheology of the injected thermoset.
Video: Simulated filling phase of the resin transfer molding process for a PCBA.
