Reaction injection molding of a PCBA
- 12 / 09 / 2024
The FFG funded project vPrimePCBA aims for the development, implementation and validation of a concept for virtual prototyping of encapsulated electronics with protection against chemical cleaning as well as steam pressure sterilization for medical devices.
Together with Polymer Competence Center Leoben GmbH and Ottronic Regeltechnik Gesellschaft m.b.H. we develop a simulation process based on open-source software for the reaction injection molding (RIM) of PCBAs and investigate the impact of RIM on solder joints.
The animation shows the filling stage of a RIM process for a generic PCBA assembled with chip resistors, MLCCs and QFNs. The colormap represents the degree of cure of the injected thermoset.
Video: Filling stage of the reaction injection molding process for a PCBA.
